On 9 July 2026, the National Technical Committee 114 on Automotive Standardization (SAC/TC114) reported that in the first half of 2026, under the guidance of the Ministry of Industry and Information Technology (MIIT), 10 sector standards on automotive chip products were officially released. They represents the substantive implementation of the Guidelines for the Construction of the National Automotive Chip Standardization System and signals that China’s automotive chip industry is accelerating into a new phase where standards are available to rely upon. To date, the automotive chip standard system has cumulatively released 14 standards (including national and sector standards), with more than 10 additional standards having completed the approval process.
The 10 recently released automotive chip product standards cover critical domains including control, computing, security, communication, and sensing. They provide a common technical foundation for the design and development, testing and evaluation, and selection and application of automotive chips; offer essential support for the industry chain to mprove quality and efficiency; and lay an important groundwork for building a secure hardware foundation for vehicles and safeguarding the high-quality development of the automotive industry.
These standards include:
Control Chips
- QC/T 1288-2026 Technical requirements and test methods of control chip for automotive
- QC/T 1290-2026 Technical requirements and test methods for automotive chassis control chips
These establish general requirements for microcontrollers capable of independently operating and controlling automotive system components and specify high-reliability and high-safety requirements for chips used in safety-critical systems such as chassis.
Computing Chips
- QC/T 1278-2026 Technical requirements and test methods of driving automation computing chip for vehicle
- QC/T 1293-2026 Technical requirements and test methods of computing chip for intelligentcockpit of vehicle
These focus on the core demands of high real-time performance and high safety for driving automation systems, and address the application characteristics of multi-task concurrency, multimedia interaction, and in-vehicle entertainment operation in human-machine interaction scenarios, proposing relevant requirements and test methods for computing chips.
Sensing Chips
- QC/T 1289-2026 Technical requirements and test methods of automotive infrared thermal imaging chip
This provides important selection criteria and technical benchmarks for the integration of infrared thermal imaging chips into vehicles and for all-weather perception solutions in driving automation systems, enhancing sensing redundancy under low-illumination and severe weather conditions.
Extravehicular Communication Chips
- QC/T 1287-2026 Technical requirements and test methods of automotive satellite positioning chips
- QC/T 1270-2026 Electronic toll collection –On board unit integrated circuits – Technical requirements and testing methods
These comprehensively cover mainstream technical forms including BeiDou single-mode, BeiDou-priority, and BeiDou multi-mode, ensuring stable and reliable operation of automotive satellite positioning chips; and clarify dedicated performance thresholds and scenario-adaptation requirements for ETC chips, constructing a comprehensive and implementable ETC chip product testing and evaluation system covering both functionality and performance.
In-Vehicle Communication Chips
- QC/T 1286-2026 Automotive Ethernet 100Mbps physical layer interface (PHY) chips technical requirements and test methods
- QC/T 1291-2026 Automotive serializer and deserializer (SerDes) chip technical requirements and test methods
These clarify the technical specifications and test methods for 100Mbps PHY and SerDes chips, unify product verification norms, and ensure the reliability and consistency of high-speed in-vehicle communication chips.
Security Chips
- QC/T 1277-2026 Technical requirements and test methods for vehicle security chip
This establishes a technical system encompassing functionality, performance, electrical characteristics, electromagnetic compatibility, functional safety, information security, environmental and reliability, and R&D and production assurance, providing detailed examples for typical application scenarios and key parameters.
The release of these 10 automotive chip standards marks a step in the phased development of China’s automotive chip standardization work. Under the Construction Guidelines, China plans to formulate more than 70 automotive chip standards by 2030, covering fundamentals, general requirements, product and technology applications, and matching tests. Additional standards are expected to follow as the work programme advances.
