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On December 20, 2025, the 4th HiPi Chiplet Forum themed “Exploring Chip Frontiers, Driving New Intelligence,” was successfully convened in Beijing. Organized by the Zhongguancun High-Performance Chip Interconnection Technology Alliance (HiPi Alliance), the main forum attracted over 600 participants, including academicians, industry leaders, and representatives from across the integrated circuit (IC) supply chain. Senior Chinese officials from the […]
