On December 20, 2025, the 4th HiPi Chiplet Forum themed “Exploring Chip Frontiers, Driving New Intelligence,” was successfully convened in Beijing. Organized by the Zhongguancun High-Performance Chip Interconnection Technology Alliance (HiPi Alliance), the main forum attracted over 600 participants, including academicians, industry leaders, and representatives from across the integrated circuit (IC) supply chain. Senior Chinese officials from the Ministry of Industry and Information Technology (MIIT), the Beijing Municipal Commission of Development and Reform, and the Beijing Economic-Technological Development Area (BDA) delivered opening remarks. The discussions of the forum centered on Chiplet frontier technologies, standardization progress, industrial application, and ecosystem development.
A key focus was the formal release and promotion launch of a national standard series on Chiplet interconnection. Guided by the National Technical Committee for Standardization of Integrated Circuits (SAC/TC599), the HiPi Alliance led the development of the GB/T 46280-2025 Specification for chiplet interconnection interface, including Part 1: General Principles, Part 2: Protocol layer technical requirements, Part 3: Data link layer technical requirements, Part 4: Physical layer technical requirements based on 2D package, and Part 5: Physical layer technical requirements based on 2.5D package. Officially published in August 2025, these standards are described as a “milestone breakthrough” in China’s Chiplet standardization efforts. The launching ceremony marked the official kick-off for their widespread implementation, with representatives from drafting and implementing organizations like the HiPi Alliance, China Electronics Standardization Institute (CESI), HiSilicon, China Mobile Research Institute (CMRI), and several key domestic firms in attendance.
At the forum, technical presentations highlighted China’s research and development priorities. Academician Luo Yi from Tsinghua University advocated for photonic-electronic heterogeneous integration, using silicon photonics and co-packaged optics to address AI computing’s power and thermal challenges. Academician Liu Sheng stated that integrating vacuum interconnection with Chiplet technology will advance chip reliability to parts-per-billion (ppb) levels, boosting innovation in China’s IC sector. Zhang Xin from the Semiconductor Manufacturing International Corporation (SMIC) called for deeper “trinity” collaboration between manufacturing, design, and services to build a self-reliant Chiplet ecosystem.
In his address, Wu Huaqiang, Vice President of Tsinghua University, outlined the HiPi Alliance’s role in fostering Chiplet industry collaboration. He presented the alliance’s roadmap for association standards spanning from interface specifications to testing, design, and materials, along with its plans for their upgrade to national standards. Additionally, he highlighted 3D IC technology—which enhances bandwidth, reduces latency and power consumption, and minimizes chip area through vertical stacking—as a key trend for high-performance chips. Going forward, the HiPi Alliance will continue to strengthen standardization and ecosystem development to drive innovation in China’s IC industry.
Chinese source of the article: https://mp.weixin.qq.com/s/EJjL2StLuLHKlqaEulJgBg
