From 22 to 26 May 2023, the secretariat of the Subcommittee on Automotive Electronics EMC (SC29) and the Subcommittee on Intelligent and Connected Vehicle (SC34), both under China’s National Road Vehicles Standardization Technical Committee (SAC/TC114), jointly convened a series of meeting on standardization issues for automotive chips. The meetings were hosted by the National New Energy Vehicle Technology Innovation Center, and saw the attendance of more than 300 experts, representing domestic and foreign enterprises operating in the production of complete vehicles, components, chips and relevant technologies. In general, the meetings can be seen as a response to the requirements set by MIIT’s Guidelines for the Establishment of the National Automotive Chip Standardization System (2023).
Specifically, the meetings reviewed the work completed so far, and outlined upcoming plans. From 22 to 25 May, in accordance with the work plan, the secretariat held a total of 12 meetings, including: inaugural meetings for the establishment of drafting groups for automotive memory chips standards and automotive infrared thermal imaging chips standards; first meeting of the drafting group for automotive microcontroller unit chip standards; meetings for various standardization projects, such as Automotive chip information security technical specifications, Intelligent and connected vehicles – Intelligent driving computing chip, Technical requirements and test methods of automotive satellite positioning chip, etc. Detailed discussions took place on the drafting progress and content of the standards, and consensus was reached on the work plan.
In addition, on 26 May, the secretariat organized the 2023 First Meeting of the Automotive Chip Standards Research Working Group. During the meeting, the secretariat reported on the 2022 work summary and the 2023 work plan. Specifically, the progress of six standard drafting groups was illustrated in detail, including for information security of automotive chips, automotive security chips, automotive computing chips, automotive in-car communication chips, automotive cellular and direct communication chips, and automotive Electronic Toll Collection (ETC) system chips.
