On November 14, 2025, the inaugural meeting of the Integrated Circuit (IC) Specialized Equipment and Components Working Group under the National Technical Committee on Integrated Circuit (SAC/TC599/WG8) was successfully convened in Beijing. The WG8 covers 50 member units encompassing leading manufacturers, end-users, and research institutes in the domestic IC equipment and component sector. The event was attended by Mr. Yang Xudong, Director of the Electronic Information Department at the Ministry of Industry and Information Technology (MIIT), Mr. Luo Faming, Secretary of the Commission for Discipline Inspection at the China Electronics Standardization Institute (CESI), along with over 90 representatives from member units.
Director Yang Xudong highlighted the working group’s establishment as a pivotal step to systematically advance standardization across the IC industry chain, laying a solid foundation for core-tech breakthroughs and greater adoption of domestic equipment and components. He urged leveraging standardization to overcome bottlenecks, improve the industrial ecosystem, and drive high-quality growth. Secretary Luo Faming underscored that IC equipment and components are fundamental to the industry, directly determining domestic production capacity, resilience, and innovation. He called the working group essential for boosting domestic production and achieving self-reliance—a necessary move to strengthen China’s semiconductor industry and ensure its long-term, healthy development.
In the latter session, representatives delivered keynote reports on the development of the industry standard Quality Management System for Semiconductor Equipment and Components, the Role of Standardized Component Performance Evaluation in Promoting the Microelectronics Industry’s Normative Development, and an interpretation of the Guidelines for Safety Management System Construction of Semiconductor Manufacturing Equipment Products. On the same day, over 70 representatives from the WG8 and relevant drafting units participated in a standards seminar, discussing six drafted standards including:
- Quality Management System for Semiconductor Equipment and Components
- Semiconductor Equipment – Magnetron Sputtering Equipment for Integrated Circuit Manufacturing
- Semiconductor Manufacturing Equipment – Measurement Method for RF Power Supply Output Power
- Semiconductor Equipment – Test Methods for Wet Processing Equipment for Integrated Circuit Manufacturing
- Semiconductor Equipment – Test Methods for Chemical Mechanical Polishing (CMP) Equipment for Integrated Circuit Manufacturing
- Semiconductor Equipment – Test Methods for Physical Vapor Deposition (PVD) Equipment for Integrated Circuit Manufacturing
Drawing on their practical industry experience, participating experts provided numerous constructive suggestions and reached a series of consensus on the draft standards. This has laid a solid foundation for improving the standardization system, overcoming technical bottlenecks, and enhancing the quality and competitiveness of the industrial chain. For foreign firms, this means both the challenges of intensified domestic competition and rising compliance costs, as well as opportunities to participate in the building of a new standards system and deepen local cooperation.
Chinese sources of the article: https://mp.weixin.qq.com/s/4YMrlpFy2pJcgVPJb-4Knw
