The Integrated Circuit (IC) EMC Standards Group (hereinafter referred to as the “WG”) of the Integrated Circuit Sub-Technical Committee (hereinafter referred to as the “SC”) of National Technical Committee on Semiconductor Devices (SAC/TC78/SC2) held three meetings on 27 April, 10 May, and 27 May 2022, to discuss 9 IC EMC standards (draft for WG discussion). The nine standards are:
Two IC EMC modeling standards:
· Electromagnetic Compatibility Modeling of Integrated Circuits — Part 2: Simulation Models for Electromagnetic Interference Characteristics of Integrated Circuit Emission Model – Conducted Emission (ICEM-CE)
· Electromagnetic Compatibility Modeling for Integrated Circuits — Part 3: Simulation Models for Electromagnetic Interference Characteristics of Integrated Circuit Emission Model – Radiation Emission (ICEM-RE)
Seven EMC measurement methods standards:
· Integrated Circuit Electromagnetic Emission Measurements — Part 3: Surface Scanning Method
· Electromagnetic Emission Measurement of Integrated Circuits — Part 5: Faraday Cage Method for Conducted Emission Measurement Bench
· Electromagnetic Emission Measurements for Integrated Circuits — Part 6: Magnetic Field Probe Method for Conducted Emission Measurements
· Electromagnetic Emission Measurements of Integrated Circuits — Part 8: The Ribbon-line Method for Radiative Emission Measurements
· Electromagnetic Immunity Measurements of Integrated Circuits — Part 3: High Current Injection (BCI) Method
· Electromagnetic Immunity Measurements of Integrated Circuits — Part 5: The Faraday Cage Method at the workbench
· Electromagnetic Immunity Measurements of Integrated Circuits- Part 9: Surface Scanning Method for Measurement of Radiation Immunity
Established in May 2019, the WG has been active in standards setting. In addition to the above standard projects, the WG are developing more standards for IC EMC, some of which has entered the phase of approval, including:
· Electromagnetic Emission Measurement of Integrated Circuits — Part 4:1 ω /150 ω Direct Coupling method for Conducted Emission Measurements
· Electromagnetic Immunity Measurements of Integrated Circuits — Part 2: Measurement of Radiation Immunity — TEM cell and Broadband TEM Cell Methods
· Electromagnetic Immunity Measurements of Integrated Circuits — Part 4: Direct RF Power Injection method
· Pulse Immunity Measurement of Integrated Circuit — Part 2: Synchronous Transient Injection Method”
· EMC Evaluation for Integrated Circuit Transceivers — Part 1: General Conditions and Definitions
· EMC Modeling of Integrated Circuits — Part 1: Generic Modeling Framework
· Electrostatic Discharge Sensitivity Test Line Pulse– Device Grade
In the backdrop of China strengthening its IC technologies and industry, standardizations’ role is becoming increasingly prominent. As China’s intention to establish a new TC for IC standardization is suspended, SAC/TC78/SC2 and the WGs under it remain the driving force in standards setting. This work is worth continuous attention by overseas IC-related enterprises who (intend to) have business in China.
